TF350 MECHANIC SPECIAL FLUX PASTE FOR BGA – 15ML

How to Use Mechanic TF350 Special Flux Paste for BGA

1. Preparation:
   • Step: Clean the BGA component and the PCB pads thoroughly to remove any dirt, grease, or oxidation.
   • Step: Ensure that the working area is free of contaminants and ready for soldering.
2. Application:
   • Step: Apply a small amount of TF350 flux paste to the PCB pads or the BGA balls.
   • Step: Use a precise applicator or a small brush for accurate placement of the flux paste.
3. Soldering:
   • Step: Position the BGA component onto the PCB, aligning it with the corresponding pads.
   • Step: Heat the assembly using a reflow oven, hot air rework station, or an appropriate soldering tool.
   • Step: Ensure that the temperature profile is suitable for the specific soldering process and that the solder reflows properly.
4. Cooling:
   • Step: Allow the soldered assembly to cool naturally after the reflow process is complete.
   • Step: Avoid rapid cooling, as it may cause thermal stress and potential damage to the components.
5. Cleaning:
   • Step: Clean any remaining flux residue from the PCB using an appropriate flux cleaner or isopropyl alcohol.
   • Step: Inspect the solder joints for quality and reliability, ensuring that there are no defects or issues.

1. BGA Soldering:
   • Application: Applied to BGA components and pads to facilitate the soldering process.
   • Benefit: Enhances the wetting properties of solder, ensuring strong and reliable connections.
2. BGA Rework and Repair:
   • Application: Used during the rework of BGA components, such as removing and replacing defective BGA chips.
   • Benefit: Helps in the clean removal of old solder and promotes the reflow of new solder, ensuring a quality rework.
3. SMT (Surface Mount Technology) Assembly:
   • Application: Used in the assembly of SMT components, including BGAs, to improve solder joint quality.
   • Benefit: Reduces the occurrence of solder bridges and voids, leading to better electrical performance and reliability.
4. Pre-Solder Cleaning:
   • Application: Cleans and prepares the surface of PCB pads and BGA balls before soldering.
   • Benefit: Removes oxides and contaminants, providing a clean surface for optimal solder adhesion.
5. Heat Transfer Improvement:
   • Application: Enhances heat transfer during the soldering process by improving thermal conductivity.
   • Benefit: Ensures even heat distribution, preventing thermal damage to components and improving solder reflow.