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Mechanic TF350 Special Flux Paste is specifically designed for BGA (Ball Grid Array) soldering and rework processes. This high-quality flux paste aids in the effective soldering and desoldering of BGA components on printed circuit boards (PCBs). Here are the primary uses and benefits of the Mechanic TF350 Special Flux Paste

• Key Features

1. High Activation:
   • Feature: Contains active ingredients that efficiently remove oxides and impurities.
   • Benefit: Promotes excellent solder wetting and flow, ensuring strong and reliable solder joints.
2. Non-Corrosive:
   • Feature: Formulated to be non-corrosive and non-conductive.
   • Benefit: Safe to use on PCBs and electronic components without causing damage or short circuits.
3. Residue Removal:
   • Feature: Leaves minimal residue that is easy to clean.
   • Benefit: Ensures a clean and professional finish on the PCB, improving the overall quality of the repair or assembly.
4. Wide Temperature Range:
   • Feature: Effective over a wide range of temperatures.
   • Benefit: Suitable for various soldering applications, including those requiring high-temperature profiles.
5. Ease of Application:
   • Feature: Available in a convenient paste form that is easy to apply precisely where needed.
   • Benefit: Allows for accurate application, reducing waste and improving efficiency.